Advanced Microcontroller (green rectangle) mounted on the forebody prism

Description

• 80C51 microprocessor with modest data processing capability (8 bit processor, 128K RAM, 128K EEPROM, 32 digital-to-anaalog and analog-to-digital converters)
• Low power: < 6 mW at 10 Mhz, 0.5 mW in sleep mode
• Very small and lightweight: 2.2 cubic centimeters (0.13 cubic inches) and 3.2 grams (1/10th an ounce)
• Capable of surviving high shock (<30,000 Gs) and low temperatures (> 120 C or -184 F)
• High Density Interconnect (HDI) electronics packaging

Why is it exciting?

• Multi-mission and application capability
• Low mass and volume
• High shock packaging

Who needs it?

• Small systems or instruments, including microprobe, solar panel actuators, distributed propulsion systems, cryo-coolers, health and status monitors

Developers/Suppliers

• Technology Associates
• Boeing Co.
• Lockheed-Martin
• General Electric
• Langley Research Center (LaRC)
• University of Tennessee
• Mission Research Corp.